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Germany – Microelectronic machinery and apparatus – Increased Throughput Bonder (IZM-02) - PR915564-2590-P

Issued by Fraunhofer-Gesellschaft - Einkauf B12
Published on August 12, 2025
DEU

Tender Description

Increased Throughput Bonder (IZM-02)

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Germany – Microelectronic machinery and apparatus – Increased Throughput Bonder (IZM-02) - PR915564-2590-P | Public Tender | tend.ee