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Germany – Microelectronic machinery and apparatus – High Precision bonder for wafer and chiplet level assembly (IZM-01 - PR915599-2590-P

Issued by Fraunhofer-Gesellschaft - Einkauf B12
Published on July 8, 2025
DEU

Tender Description

High Precision bonder for wafer and chiplet level assembly (IZM-01)

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