Austria – Laboratory, optical and precision equipments (excl. glasses) – Silicon Austria Labs – Chips JU: High power impulse magnetron sputtering and inductively-coupled plasma etching (HiPIMS & ICP)
Tender Description
The aim of this procurement procedure is to award the contract to the best bidder identified during the procurement procedure for the supply, installation and commissioning of two module chambers capable of high-power impulse magnetron sputtering and inductively coupled plasma surface preparation intended for the fabrication of various metal thin films, for Silicon Austria Labs GmbH.
Unlock Full Tender Insight
Complete details, deadlines, and AI-powered analysis are available inside the tend.ee platform. Create your free account to access.
It's free to get started. No credit card required.